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百度彩票新疆时时彩 www.hyfs.icu Dual Inline Packagee

 

Applications

 Power Management (DC-DC, AC-DC) 

 LED Driver

 Logic Device,

 Industry Controller

Features:

 JEDEC Standard package outlines

 Au, Cu, Ag-alloy, Al bonding process capabilities

 Multi-chip capability for stack or flat lie

 Lack Pin6 or Pin7 is optional for SOP 7L

 Component surface  mount capability

Package Outlines   Dimensions:

Package

Body Size

(mm)

Footprint

(mm)

Footprint

(mm)

Lead Pitch

(mm)

Total Height

(mm)

DIP 7L6.38*9.25*3.278.723.982.547.16
      DIP系列