• 新时代 新篇章 聚焦2018湖北两会 2019-02-23
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    百度彩票新疆时时彩 www.hyfs.icu

    Dual Inline Packagee


     

    Applications

     Power Management (DC-DC, AC-DC) 

     LED Driver

     Logic Device,

     Industry Controller

    Features:

     JEDEC Standard package outlines

     Au, Cu, Ag-alloy, Al bonding process capabilities

     Multi-chip capability for stack or flat lie

     Lack Pin6 or Pin7 is optional for SOP 7L

     Component surface  mount capability

    Package Outlines   Dimensions:

    Package

    Body Size

    (mm)

    Footprint

    (mm)

    Footprint

    (mm)

    Lead Pitch

    (mm)

    Total Height

    (mm)

    DIP 8L6.38*9.25*3.278.723.982.547.16
          DIP系列 

  • 新时代 新篇章 聚焦2018湖北两会 2019-02-23