• 新时代 新篇章 聚焦2018湖北两会 2019-02-23
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    百度彩票新疆时时彩 www.hyfs.icu Land Grid Array

     

    Applications

     RF,Wireless, GPS, Switch Devices 

     Logic,Analog, and MEMS Sensors

     SiP Solutions

     Industry Micro-Controller

    Features:

     Customized package size and leads in limited body size (1~ mm )

     Au, Cu, Ag-alloy bonding process capabilities

     Multi-chip capability for stack or flat lie

     Component surface mount capability

     Ni/Au,Ni/Pd-Au surface finish

    Reliability Condition:

     Moisture Sensitivity Pre-condition :
       -MSL3: [email protected]℃/60% RH
       -MSL1: [email protected]℃/85% RH

     Temperature Cycle: 500 cycles @ -65℃ /+150℃

     Highly Accelerated Temp and Humidity Stress Test: 96hrs @130oC/85% RH

     High Temperature Storage: [email protected]

    Package Outlines   Dimensions:

    Substrate
    Formats
    (mm)

    Standard

    Sub. Thickness

    (mm)

    Standard

    Sub. Layer

    Mold Cap

    Thickness

    (mm)

    Pkg Thickness

    (mm)

    189*68
    2 Block
    Min: 0.150
    Max: 0.360
    2/4/60.375
    0.550
    0.750
    >0.500
          基板封装 

  • 新时代 新篇章 聚焦2018湖北两会 2019-02-23