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百度彩票新疆时时彩 www.hyfs.icu Small Outline Package

 

Applications

 Power Management (DC-DC, AC-DC) 

 LED   Driver

 Flash Memory (Nor Flash, EEPROM)

 Industry Controller

Features:

 JEDEC Standard package outlines

 Au, Cu, Ag-alloy, Al bonding process   capabilities

 Multi-chip capability for stack or flat lie

 Exposed die pad packaging  (eSOP)

 Lack Pin6 or Pin7 is optional for SOP 7L

 Component surface mount capability

Reliability Condition:

 Moisture Sensitivity Pre-condition :
   -MSL3: [email protected]℃/60% RH
   -MSL1: [email protected]℃/85% RH

 Temperature Cycle: 500 cycles @ -65℃ /+150℃

 uHAST:96hrs @130℃/85% RH

 High Temperature Storage: [email protected]

Package Outlines   Dimensions:

PackageBody Size
(mm)
Footprint
(mm)
Stand Off
(mm)
Lead Pitch
(mm)
Total Height
(mm)
SOP 7L3.9*4.9*1.46.00.151.27 1.55
      SOP系列